题 目：多孔骨架硫化学的发端和现状--兼谈如何选导师
主讲人：徐政涛教授
Department of Biology and Chemistry, City University of Hong Kong, Hong Kong, China
时 间：2015年10月20日（周二）上午10：00
地 点：化院老楼三楼大会议室
讲座摘要：
The story is one of closing the gaps, i.e., the insulating gap in metal-organic frameworks (MOFs), and the gap in the synthetic strategies for porous metal-thiolate solids; both critically relevant to next-generation electronic and catalytic materials. We recount the quest for recipes—the ones broadly effective for tackling the intractable metal-sulfur link in both network construction and in catalytic applications. In a simple, one-pot recipe, rigid, chelating aromatic thiols directly react with metal ions to form porous frameworks. The resultant metal-dithiolene nets inaugurate a class of covalent metal-organic frameworks (CMOF) that not only feature versatile electroactive and ion-exchange capabilities, but also bridge the two parallel fields of MOFs and porous polymers. In the hard-and-soft design, carboxyl and sulfur groups make for a versatile, stepwise approach: 1) hard ions like Zr(IV) selectively engages the carboxyl groups to set up the host net; 2) the dangling thiol donors can then take up metal guests to afford the metal-thiolate function which can be deployed either as electroactive cross-links for closing up the insulating gap in the solid state framework, or as solitary units with open metal sites for leach-free, bona fide heterogeneous catalysis (see figure).
主讲人简介：
徐政涛教授，1996年毕业于北京大学获化学学士学位，1998年获得密西根州立大学(University of Michigan at Ann Arbor)有机化学硕士学位，2001年获得康奈尔大学(Cornell University)材料化学博士学位。2001-2003年在IBM 研发中心从事博士后研究。2003-2005在美国乔治华盛顿大学任助理教授，2005-至今，先后任香港城市大学生物化学系助理教授、副教授、教授。其中2011-2013入选“洪堡学者”（ Humboldt Research Fellowship for Experienced Researchers），在德国马普所从事研究工作。主持过美国化学会石油研究基金、香港政府研究基金多项（research grants from the Research Grant Council of the Hong Kong government），总研究经费超过400万港币。研究兴趣主要包括新型多孔聚合物和金属有机框架的组装及其在传感、分离、催化和光电等领域的应用探索。近年来在JACS, Angew, Adv. Mater., Chem. Mater., Chem. Comm., Inorg. Chem.等国际著名期刊上发表高水平研究论文50多篇，总影响因子超过350，获得美国专利2项，在国际重要学术会议上应邀报告近50次。
